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Cleaned up 4 layer osh park design rules, including default netclass …
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…and some minor changes to solder masks.
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@andrewgreenberg
andrewgreenberg committed Aug 28, 2024
1 parent 77d4b4a commit f4654e7
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234 changes: 149 additions & 85 deletions drc-template-osh-park-4-layer/drc-template-osh-park-4-layer.kicad_pcb
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Original file line number Diff line number Diff line change
@@ -1,86 +1,150 @@
(kicad_pcb (version 20211014) (generator pcbnew)

(general
(thickness 1.7702)
)

(paper "A4")
(layers
(0 "F.Cu" jumper)
(1 "In1.Cu" signal)
(2 "In2.Cu" signal)
(31 "B.Cu" signal)
(34 "B.Paste" user)
(35 "F.Paste" user)
(36 "B.SilkS" user "B.Silkscreen")
(37 "F.SilkS" user "F.Silkscreen")
(38 "B.Mask" user)
(39 "F.Mask" user)
(40 "Dwgs.User" user "User.Drawings")
(41 "Cmts.User" user "User.Comments")
(44 "Edge.Cuts" user)
(45 "Margin" user)
(46 "B.CrtYd" user "B.Courtyard")
(47 "F.CrtYd" user "F.Courtyard")
(48 "B.Fab" user)
(49 "F.Fab" user)
)

(setup
(stackup
(layer "F.SilkS" (type "Top Silk Screen") (color "White") (material "Liquid Photo"))
(layer "F.Paste" (type "Top Solder Paste"))
(layer "F.Mask" (type "Top Solder Mask") (color "Purple") (thickness 0.0254) (material "Liquid Ink") (epsilon_r 3.3) (loss_tangent 0))
(layer "F.Cu" (type "copper") (thickness 0.0432))
(layer "dielectric 1" (type "prepreg") (thickness 0.2021) (material "FR408-HR") (epsilon_r 3.69) (loss_tangent 0.0091))
(layer "In1.Cu" (type "copper") (thickness 0.0175))
(layer "dielectric 2" (type "core") (thickness 1.1938) (material "FR408-HR") (epsilon_r 3.69) (loss_tangent 0.0091))
(layer "In2.Cu" (type "copper") (thickness 0.0175))
(layer "dielectric 3" (type "prepreg") (thickness 0.2021) (material "FR408-HR") (epsilon_r 3.69) (loss_tangent 0.0091))
(layer "B.Cu" (type "copper") (thickness 0.0432))
(layer "B.Mask" (type "Bottom Solder Mask") (color "Purple") (thickness 0.0254) (material "Liquid Ink") (epsilon_r 3.3) (loss_tangent 0))
(layer "B.Paste" (type "Bottom Solder Paste"))
(layer "B.SilkS" (type "Bottom Silk Screen") (color "White") (material "Liquid Photo"))
(copper_finish "ENIG")
(dielectric_constraints no)
)
(pad_to_mask_clearance 0)
(solder_mask_min_width 0.1016)
(pcbplotparams
(layerselection 0x00010fc_ffffffff)
(disableapertmacros false)
(usegerberextensions false)
(usegerberattributes true)
(usegerberadvancedattributes true)
(creategerberjobfile true)
(svguseinch false)
(svgprecision 6)
(excludeedgelayer true)
(plotframeref false)
(viasonmask false)
(mode 1)
(useauxorigin false)
(hpglpennumber 1)
(hpglpenspeed 20)
(hpglpendiameter 15.000000)
(dxfpolygonmode true)
(dxfimperialunits true)
(dxfusepcbnewfont true)
(psnegative false)
(psa4output false)
(plotreference true)
(plotvalue true)
(plotinvisibletext false)
(sketchpadsonfab false)
(subtractmaskfromsilk false)
(outputformat 1)
(mirror false)
(drillshape 1)
(scaleselection 1)
(outputdirectory "")
)
)

(net 0 "")

(kicad_pcb
(version 20240108)
(generator "pcbnew")
(generator_version "8.0")
(general
(thickness 1.7702)
(legacy_teardrops no)
)
(paper "USLedger")
(title_block
(title "Schematic Title!")
(date "2024-08-26")
(rev "1.0")
)
(layers
(0 "F.Cu" signal)
(1 "In1.Cu" signal)
(2 "In2.Cu" signal)
(31 "B.Cu" signal)
(34 "B.Paste" user)
(35 "F.Paste" user)
(36 "B.SilkS" user "B.Silkscreen")
(37 "F.SilkS" user "F.Silkscreen")
(38 "B.Mask" user)
(39 "F.Mask" user)
(40 "Dwgs.User" user "User.Drawings")
(41 "Cmts.User" user "User.Comments")
(44 "Edge.Cuts" user)
(45 "Margin" user)
(46 "B.CrtYd" user "B.Courtyard")
(47 "F.CrtYd" user "F.Courtyard")
(48 "B.Fab" user)
(49 "F.Fab" user)
)
(setup
(stackup
(layer "F.SilkS"
(type "Top Silk Screen")
(color "White")
(material "Liquid Photo")
)
(layer "F.Paste"
(type "Top Solder Paste")
)
(layer "F.Mask"
(type "Top Solder Mask")
(color "Purple")
(thickness 0.0254)
(material "Liquid Ink")
(epsilon_r 3.3)
(loss_tangent 0)
)
(layer "F.Cu"
(type "copper")
(thickness 0.0432)
)
(layer "dielectric 1"
(type "prepreg")
(thickness 0.2021)
(material "FR408-HR")
(epsilon_r 3.69)
(loss_tangent 0.0091)
)
(layer "In1.Cu"
(type "copper")
(thickness 0.0175)
)
(layer "dielectric 2"
(type "core")
(thickness 1.1938)
(material "FR408-HR")
(epsilon_r 3.69)
(loss_tangent 0.0091)
)
(layer "In2.Cu"
(type "copper")
(thickness 0.0175)
)
(layer "dielectric 3"
(type "prepreg")
(thickness 0.2021)
(material "FR408-HR")
(epsilon_r 3.69)
(loss_tangent 0.0091)
)
(layer "B.Cu"
(type "copper")
(thickness 0.0432)
)
(layer "B.Mask"
(type "Bottom Solder Mask")
(color "Purple")
(thickness 0.0254)
(material "Liquid Ink")
(epsilon_r 3.3)
(loss_tangent 0)
)
(layer "B.Paste"
(type "Bottom Solder Paste")
)
(layer "B.SilkS"
(type "Bottom Silk Screen")
(color "White")
(material "Liquid Photo")
)
(copper_finish "ENIG")
(dielectric_constraints no)
)
(pad_to_mask_clearance 0)
(allow_soldermask_bridges_in_footprints no)
(pcbplotparams
(layerselection 0x00010fc_ffffffff)
(plot_on_all_layers_selection 0x0000000_00000000)
(disableapertmacros no)
(usegerberextensions no)
(usegerberattributes yes)
(usegerberadvancedattributes yes)
(creategerberjobfile yes)
(dashed_line_dash_ratio 12.000000)
(dashed_line_gap_ratio 3.000000)
(svgprecision 6)
(plotframeref no)
(viasonmask no)
(mode 1)
(useauxorigin no)
(hpglpennumber 1)
(hpglpenspeed 20)
(hpglpendiameter 15.000000)
(pdf_front_fp_property_popups yes)
(pdf_back_fp_property_popups yes)
(dxfpolygonmode yes)
(dxfimperialunits yes)
(dxfusepcbnewfont yes)
(psnegative no)
(psa4output no)
(plotreference yes)
(plotvalue yes)
(plotfptext yes)
(plotinvisibletext no)
(sketchpadsonfab no)
(subtractmaskfromsilk no)
(outputformat 1)
(mirror no)
(drillshape 1)
(scaleselection 1)
(outputdirectory "")
)
)
(net 0 "")
)
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