linux4microchip+fpga-2025.10 Release (PolarFire SoC)
This is the PolarFire SoC 2025.10 Linux4Microchip Yocto Project BSP release.
The main changes in this release include the addition of a new meta-mchp-distro layer that defines top-level policy configurations for the Microchip Linux distribution. As part of this change, the BSP layers were restructured, with general distro-wide configuration content moved to the Distro layer, leaving the BSP layers focused solely on hardware platform metadata. The Distro layer is enabled by default in the provided sample configuration templates.
In addition, the PIC64 layer was added to meta-mchp to provide support for the PIC64GX Curiosity Kit platform.
Pre-built images for the Icicle Kit Reference Design
Pre-built images of this release targeted at the 2025.10 Icicle Kit Reference Design are available from this release's assets:
- eMMC/SD card Linux images:
- QSPI Flash Linux images:
- The core-image-minimal-mtdutils-mpfs-icicle-kit-nand.nand.mtdimg image can be flashed to an external Winbond W25N01GV flash memory
- The core-image-minimal-mtdutils-mpfs-icicle-kit-nor.nor.mtdimg image can flashed to an external Micron MT25QL256 flash memory
For more information, please refer to the Booting from QSPI documentation.
This release has been tested to work on the Icicle Kit, from eMMC, SD card, an external Winbond W25N01GV QSPI NAND flash and an external Micron MT25QL256 NOR flash memory using HSS 0.99.49 and the Icicle Kit Reference Design tag v2025.07
Pre-built images for the Discovery Kit Reference Design
A pre-built image of this release targeted at the 2025.07 PolarFire SoC Discovery Kit Reference Design is available from this release's assets.
For more information, please refer to the MPFS Discovery Kit User Guide documentation.
Changes since last release (2025.07) :
- Update U-Boot from version 2023.07 to 2025.07
- Bump Linux to linux4microchip+fpga-2025.10 (using Linux Kernel version
6.12.48) - Add meta-mchp-pic64 layer with PIC64GX Curiosity Kit support
- Add meta-mchp-distro layer and reorganize BSP layers for improved structure and maintainability
A Software Bill of Materials (SBOM), including a detailed list of all software components and their dependencies used in this release, is included as part of the release assets.